Nguyen Chi Cuong, Trinh Xuan Thang, Lam Minh Thinh, Vuong Dinh Duy Phuc, Truong Huu Ly, Ngo Vo Ke Thanh, and Le Quoc Cuong. “Analysis of a Novel 3C-SiC Thin Layer on Silicon Diaphragms for Enhanced Stress Amplification in MEMS Piezoresistive Pressure Sensors”. Vietnam Journal of Science, Technology and Engineering 66, no. 3 (September 15, 2024): 32-38. Accessed July 15, 2026. https://vietnamscience.vjst.vn/index.php/vjste/article/view/1218.