Nguyen Chi Cuong, Trinh Xuan Thang, Lam Minh Thinh, Vuong Dinh Duy Phuc, Truong Huu Ly, Ngo Vo Ke Thanh, and Le Quoc Cuong. “Analysis of a Novel 3C-SiC Thin Layer on Silicon Diaphragms for Enhanced Stress Amplification in MEMS Piezoresistive Pressure Sensors”. Vietnam Journal of Science, Technology and Engineering, vol. 66, no. 3, Sept. 2024, pp. 32-38, doi:10.31276/VJSTE.2023.0016.