NGUYEN CHI CUONG; TRINH XUAN THANG; LAM MINH THINH; VUONG DINH DUY PHUC; TRUONG HUU LY; NGO VO KE THANH; LE QUOC CUONG. Analysis of a novel 3C-SiC thin layer on silicon diaphragms for enhanced stress amplification in MEMS piezoresistive pressure sensors. Vietnam Journal of Science, Technology and Engineering, [S. l.], v. 66, n. 3, p. 32-38, 2024. DOI: 10.31276/VJSTE.2023.0016. Disponivel em: https://vietnamscience.vjst.vn/index.php/vjste/article/view/1218. Acesso em: 15 jul. 2026.