Nguyen Chi Cuong, Trinh Xuan Thang, Lam Minh Thinh, Vuong Dinh Duy Phuc, Truong Huu Ly, Ngo Vo Ke Thanh, & Le Quoc Cuong. (2024). Analysis of a novel 3C-SiC thin layer on silicon diaphragms for enhanced stress amplification in MEMS piezoresistive pressure sensors. Vietnam Journal of Science, Technology and Engineering, 66(3), 32-38. https://doi.org/10.31276/VJSTE.2023.0016