Nguyen Chi Cuong, Trinh Xuan Thang, Lam Minh Thinh, Vuong Dinh Duy Phuc, Truong Huu Ly, Ngo Vo Ke Thanh and Le Quoc Cuong 2024. Analysis of a novel 3C-SiC thin layer on silicon diaphragms for enhanced stress amplification in MEMS piezoresistive pressure sensors. Vietnam Journal of Science, Technology and Engineering. 66, 3 (Sep. 2024), 32-38. DOI:https://doi.org/10.31276/VJSTE.2023.0016.